High-speed collision of copper nanoparticles with aluminum surface: Inclined impact, interaction with roughness and multiple impact

VV Pogorelko and VS Krasnikov and AE Mayer, COMPUTATIONAL MATERIALS SCIENCE, 142, 108-121 (2018).

DOI: 10.1016/j.commatsci.2017.10.015

Using molecular dynamic simulation, we investigate the influence of the angle of incidence and surface roughness at the high-speed collision of copper nanoparticles with aluminum surface. Also, special attention is devoted to the consideration of several successive collisions. Nanoparticles with a diameter of 16.2 nm and a collision speed of 500 and 1000 m/s are considered. An increase in the angle of incidence of the nanoparticle leads to a lower defect structure in the surface layer of the substrate and reduces the adhesion of the deposited particle to the substrate. The presence of a roughness on the surface always leads to decrease in the total length of dislocations remaining in the substrate after collision; this decrease is due to the escape of some dislocations on the lateral surface of the protrusions on the substrate. The depth of the modified layer formed by several successive collisions of nanoparticles with the aluminum surface does not exceed the size of the nanoparticle. In the case of successive collisions of nanoparticles, the use of collision speed of 1000 m/s is optimal, since it ensures a minimum porosity of the formed copper layer. The hardness of the formed copper layer at successive collisions of nanoparticles is below the hardness of a copper single crystal by 30-45%. At the same time, the copper layer has good adhesion properties, which are comparable with the adhesion properties of copper atoms to a copper single crystal. (C) 2017 Elsevier B.V. All rights reserved.

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