Interfacial effect on deformation and failure of Al/Cu nanolaminates under shear loading

C Lv and J Yang and XP Zhang and Y Cai and XY Liu and GJ Wang and SN Luo, JOURNAL OF PHYSICS D-APPLIED PHYSICS, 51, 335301 (2018).

DOI: 10.1088/1361-6463/aad2a8

The interface effects on deformation and failure of Al/Cu nanolaminates under shear loading are investigated by molecular dynamics and analytical methods, including interface orientations and repeat layer spacing. Interface orientations play a dominant role in dislocation evolution over repeat layer spacing. Interfacial stress affects nucleation and propagation of dislocations in nanolaminates, and is modeled with an analytical form. The yield and failure of Al/Cu nanolaminates are mainly controlled by dislocation evolutions in Al and Cu layers, respectively. In particular, when repeat layer spacing is less than 12nm, the shear strength of Al(1 0 0)/Cu(1 0 0) nanolaminates decreases with decreasing repeat layer spacing due to the interaction between stacking faults and dislocations. For better shear performance, the minimum repeat layer spacing of Al/Cu nanolaminates is about 12nm, and the interface orientations can be tailored.

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