Atomic level prediction of thermal conductivity of metallic materials in IC packaging

G Zheng and H He and WH Zhu, 2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) (2018).

In this paper, an appropriate method is presented to estimate the thermal conductivity of selected metallic materials based on molecular dynamics simulations and Wiedemann-Franz Law. Both the influence of electrons and phonons are taken into account to estimate the thermal conductivity of metallic materials. A non-equilibrium molecular dynamic (NEMD) method is applied to compute the phonon contribution to thermal conductivity in selected fcc metallic materials, while the electron based thermal conductivity is obtained by Wiedemann-Franz law. The presented results indicate that the corrected model can lead to more appropriate results, the error is within 1.2%. Our work provides an insight on accurately predicting the thermal conductivity of featured metallic materials which is beneficial for thermal management in IC devices.

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