Multiscale Comparison Study of Void Closure Law and Mechanism in the Bimetal Roll-Bonding Process

QD Zhang and S Li and R Li and BY Zhang, METALS, 9, 343 (2019).

DOI: 10.3390/met9030343

The void closure mechanism during the roll-bonding process was investigated using a multiscale approach, which includes contact deformation at the macro-scale and atomic bonding at the micro-scale. The closure process of the voids was observed using roll-bonding tests of 304 stainless steel/Q235 carbon steel. A finite element model was built to simulate the macroscopic deformation process of 304/Q235 material, and a molecular dynamics model established to simulate the deformation process of the microscopic rough peaks. The closure law and mechanism of interface voids at the macro- and micro-scales were studied. The results show that the closure rate of interface voids decreases with the decrease in the average contact stress during the contact deformation process. In the atomic bonding process, the void closure rate is slow in the elastic deformation process. The ordered atoms near the interface become disordered as plastic deformation occurs, which increases the void closure rate and hinders dislocation propagation through the interface, resulting in significant strengthening effects via plastic deformation. Ultimately, a perfect lattice is reconstructed with void healing. In addition, the interface morphology after roll-bonding at the macro scale was determined by the morphology of the 304 steel with larger yield strength ratio, while the interface morphology at the micro-scale was mainly determined by the morphology of the Q235 steel with a higher yield strength.

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