Study of subsurface damage of monocrystalline nickel in nanometric grinding with spherical abrasive grain

J Ren and MR Hao and GX Liang and SY Wang and M Lv, PHYSICA B-CONDENSED MATTER, 560, 60-66 (2019).

DOI: 10.1016/j.physb.2019.02.012

In this paper, molecular dynamics is used to analyze monocrystalline nickel by spherical abrasive grinding. The effects of different grinding speeds, different grinding depths and different sizes of abrasive grains on subsurface defects are compared. According to the X-direction and Z-direction displacement of the some workpiece atoms, the subsurface formation mechanism is obtained. The subsurface defects under different grinding conditions are studied according to the Common Neighbor Analysis (CNA) technique. According to the deformation criterion, subsurface deformation depth of the workpiece under different grinding conditions is quantitatively calculated, by analyzing the potential energy curve of the atom. It is concluded that within a certain range, increased grinding speed results in reduced subsurface defects, and grinding depth is proportional to subsurface defects.

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