Elevated Temperature Compression Behavior of Al-Cu50Zr50 Nano-laminates

P Gupta and K Vaduganathan and N Yedla, TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 73, 1579-1585 (2020).

DOI: 10.1007/s12666-020-01933-9

In this work, molecular dynamics simulation studies are performed to investigate the deformation behavior of Al (metal)-Cu50Zr50 (metallic glass) nano-laminates. Three-layer nano-laminate models have been used for compression studies in which Cu50Zr50 metallic glass (thickness = 34 angstrom) is a sandwich layer between the two Al layers (33 angstrom thick). Al is modeled as a single crystal and polycrystal (average grain size similar to 3.5 nm). The deformation studies have been carried out by subjecting the nano-laminates to compression loading (y-axis; periodic boundary) at a strain rate of 10(10) s(-1) and temperatures of 400 K and 500 K. The simulation results show that the nano-laminate with Al as a polycrystalline structure exhibits higher yield strength as compared to the nano-laminate with Al as a single crystal sigma(Al,Polycrystal) = 0.376 GPa (400 K); sigma(Al,single crystal) = 0.272 GPa (400 K); sigma(Al,Polycrystal) = 0.152 GPa (500 K); sigma(Al,single crystal) = 0.129 GPa (500 K). The higher strength is attributed to the low dislocation density as observed from dislocation extraction algorithm analysis. Also, the flow stress decreases with temperature due to softening as expected.

Return to Publications page