Molecular dynamics simulation of the microscopic interaction in Cu/water nanofluid

L Zhang and LC Tian and AL Zhang and PP Qu and YY Jing and HM Chen, 2020 6TH INTERNATIONAL CONFERENCE ON ENERGY, ENVIRONMENT AND MATERIALS SCIENCE, 585, 012135 (2020).

DOI: 10.1088/1755-1315/585/1/012135

With the gradual increase in internal combustion engine load, the heat in the cooling oil cavity has been insufficient to remove too much heat in a timely manner. The excellent thermal conductivity of nanofluids can be used to consider solving such problems. In this paper, the molecular dynamics simulation of the microscopic effect of the particles in the Cu/water nanofluid on the base fluid is carried out by the equilibrium molecular dynamics method. By analyzing the density distribution of various atoms in the nanofluid and the radial distribution function between the base fluid atoms, Cu-H and Cu-O atom pairs, it is found that the main reason for the influence of the nanoparticles on the base fluid is in the area near the Cu particles. The base fluid atoms have an effect, which changes the arrangement of these atoms, and the O atoms around the nanoparticles are closer to the surface of the Cu particles, and the H atoms are slightly away from the surface of the particles.

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