Discrete Integrated Circuit Electronics (DICE)

Z Fredin and J Zemanek and C Blackburn and E Strand and A Abdel-Rahman and P Rowles and N Gershenfeld, 2020 IEEE HIGH PERFORMANCE EXTREME COMPUTING CONFERENCE (HPEC) (2020).

We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.

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