Impact induced metallurgical and mechanical interlocking in metals

CD Reddy and ZQ Zhang and S Msolli and J Guo and N Sridhar, COMPUTATIONAL MATERIALS SCIENCE, 192, 110363 (2021).

DOI: 10.1016/j.commatsci.2021.110363

In spite of many experimental and modeling studies reported in the literature, a fundamental understanding of the bonding mechanisms for a supersonic metal particle impinging onto a metal substrate is still an open problem. We show here with molecular dynamics simulations for copper/copper system, impact induced local melting leading to adhesive bonding at the interface. More importantly, we identify the bonding mechanisms as a combination of metallurgical, mechanical and grain boundary interlocking at the interface region. The formation of metallurgical interlocking has heretofore never been reported in the literature. Nanotwins and grain refinement in the particle are also very pervasive.

Return to Publications page