The coalescence of Cu nanoparticles with different interfacial lattice structures: A molecular dynamics study

JC Cao and LL Li and C Zhang, MODERN PHYSICS LETTERS B, 35, 2150149 (2021).

DOI: 10.1142/S0217984921501499

With the popularization of 3D printing technology, micro/nanoparticles sintering technology has drawn lots of attentions all over the world. Here, molecular dynamic simulation is employed to discuss the effects of different interfacial lattice structures, different diameter of nanoparticles, and different heating rates on the coalescence of metallic Cu nanoparticles. The results showed that the diameter of nanoparticles determine the melting point of the system. Besides, the interfacial lattice structure, diameter of nanoparticles, and heating rate have an influence on the initial sintering temperature. This is because the melting point is the inherent property of material which relies on the mass of substance. However, the initial sintering temperature is sensitive to many factors, including the temperature, interfacial, and intermolecular interactions.

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