Effect of void in deformation and damage mechanism of single crystal copper: a molecular dynamics study
A Rajput and SK Paul, MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 29, 085013 (2021).
The current study investigates the deformation and damage mechanism of single crystal copper in the presence of a void located at the copper cell center. Tensile and compressive deformations are conducted in two loading modes, uniaxial and triaxial. Alteration in mechanical properties is observed due to the presence of void in different deformation modes. In uniaxial deformation, a smooth gradient in stress and strain distribution are evident before dislocation nucleation, i.e. in the elastic domain. However, inhomogeneity in stress and strain distribution are noted during the plastic deformation, i.e. after dislocations emission. Stress concentration remains high near the void surface ahead of the dislocation emission. Stress and strain concentration play a substantials role in nucleating defects (i.e. dislocation and stacking fault) from the void surface. Moreover, the void growth in tension and void shrinking in compression are found due to the emission/shrink of dislocations from the void surface. Consequently, an effective rate of dislocation emission enhances the growth rate of the void, as it happens in triaxial tensile deformation.
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