Numerical modeling of low-temperature and low-pressure sintering of silver microparticles based on surface and grain boundary diffusion mechanisms

XD Wang and L Benabou, MECHANICS OF ADVANCED MATERIALS AND STRUCTURES, 29, 1601-1613 (2022).

DOI: 10.1080/15376494.2020.1831659

In this article, the low-temperature (300 degrees C) sintering process of silver microparticles is modeled based on coupled diffusion mechanisms. Simulations are carried out for the simplest two-particle model and for various multiparticle arrangements. Sintering evolution was studied by evaluating densification, shrinkage rate, grain boundary growth under the effect of low uniaxial sintering pressure (1 to 5 bars). It is found that the gain provided by the applied pressure is limited to the grain boundary diffusion in the early stage of sintering. Sintering of a more complicated randomly-generated aggregate of 40 silver particles is also simulated.

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