Mechanical response of single-crystal copper under vibration excitation based on molecular dynamics simulation

QY Zheng and ZY Zhou and C Ding and Y Li and E Lin and SB Ye and ZY Piao, JOURNAL OF MANUFACTURING PROCESSES, 75, 605-616 (2022).

DOI: 10.1016/j.jmapro.2021.11.066

Since high-frequency vibration is usually used to assist metal processing in improving processing efficiency and quality. An in-depth understanding of the strengthening mechanism of high-frequency vibration-assisted metal processing is essential. In this paper, molecular dynamics (MD) simulation is performed for scratching under different vibration-assisted conditions, non-vibration-assisted, one- dimensional vibration-assisted, and two-dimensional vibration-assisted, to investigate the effect of high-frequency vibration on the scratching process of single-crystal copper at the atomic scale. Based on crystal defect analysis technology and dislocation theory, the influence mechanism of high-frequency vibration on the surface morphology, tangential force change, po-tential energy change, and dislocation defect structure evolution of single-crystal copper is studied. By analyzing the MD results, it is found that vibration-assisted scratching significantly improved the surface quality of single-crystal copper and reduced the tangential force of spherical diamond and that two- dimensional vibration-assisted scratching has the best effect. Vibration-assisted scratching experiments are also conducted to compare the experimental results with the molecular dynamics simulation results to verify the accuracy and credibility of the molecular dynamics simulation.

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