Synergistically enhanced interface stability by graphene assisted copper surface reconstruction

KM Yang and Q Li and Q Zhang and GS Liu and JJ Wang and YF Yang and CX Guo and JM Ni and J Song and J Zhang and Y Liu and TX Fan, ACTA MATERIALIA, 226, 117638 (2022).

DOI: 10.1016/j.actamat.2022.117638

Graphene (Gr)/Copper (Cu) composites have shown great potential in thermal-management and information-transport applications. The influences of interface related characteristics, such as orienta-tion, adhesion energy and localized strain are of great importance, however, rarely reported. In this work, by conducting heavy ions irradiation and thermal boundary conductance characterization (by time-domain thermoreflectance technique), we examined the intrinsic relationship between microstructural characteristics and interface stability of various Gr/Cu interfaces, such as Gr/10 0 Cu, Gr/111 Cu, and Gr/111/100 Cu. Here we report: (1) compared to Gr/111 Cu interfaces, Gr/10 0 Cu interfaces exhibit higher defect sink capability, and (2) Gr/111/100 Cu interfaces possess both high defect sink capabil-ity and good interface stability. Our atomistic simulations suggest higher interface volumetric stress of Gr/10 0 Cu interface. The synergistic enhancement of Gr/111 Cu and 111/100 Cu interfaces is at-tributed to coherent interface generated by Gr assisted Cu surface reconstruction. The present findings may provide more insight to understand the interface characteristics-stability relation of carbon/metal composites. (c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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