Amorphous silica glass nano-grooving behavior investigated using molecular dynamics method

YC Lin and CY Wu, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 236, 1443-1452 (2022).

DOI: 10.1177/09544054221078094

This work uses molecular dynamics to simulate the grooving behavior of optical silica glass. The amorphous SiO2 (silica glass) was fabricated using a melting-quenching process, and the critical cut depth, and mechanism of the chip formation, were explored using a molecular dynamics simulation. The analytical results indicated that the tool edge radius affected the critical cut depth and roughness of the machined surface. A larger tool edge radius had a larger equivalent negative rake angle at the same depth of cut, causing a larger critical cut depth, while producing a smoother machined surface. In addition, the uncut chip thickness affected the tangential force and thrust force distribution weighting of the tool. The temperature field analysis revealed that a groove formed by the chip formation mechanism resulted in a higher workpiece temperature, causing the brittle material to exhibit ductile cutting behavior during the nanogrooving process. However, grooves formed by the scratching-indenting mechanism had a lower workpiece temperature.

Return to Publications page