Analysis on the Impact of Creep Environment and Grain Size During Biaxial Creep Characterization on the Creep Features of Ferrosilicon Alloy: a Molecular Dynamics Study

S Gowthaman and T Jagadeesha and V Dhinakaran, SILICON, 14, 11633-11646 (2022).

DOI: 10.1007/s12633-022-01887-1

The underlying deformation mechanism of ferrosilicon polycrystal alloy during biaxial creep characterization has been explored through molecular dynamics. In this study, the biaxial creep study has been directed under various grain size (3.62 nm, 4.02 and 4.61 nm) and applied pressure (1 GPa, 2 GPa, 3 GPa, 4 GPa and 5 GPa) at a constant temperature of 450 K, to study its impact on the creep behavior and its features on the ferrosilicon polycrystal alloy. Through the above scrutiny, it is originated that the applied pressure has invoked a bigger outcome on the creep performance trailed by the grain size, owed to the reduction in the deformation resistance as a function of creep deformation time. Further, the vacancy formation behavior and RDF (Radial Distribution Function) analysis has confirmed the reduction in the deformation resistance amid the atoms. Moreover, the three- dimensional OIM map and instantaneous angle of various grains has discovered the grain rotational behavior during biaxial creep characterization.

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