Nanoscale Thin-Film Boiling Processes on Heterogeneous Surfaces

S Gao and J Qu and ZC Liu and W Liu, LANGMUIR, 38, 6352-6362 (2022).

DOI: 10.1021/acs.langmuir.2c00276

Acquiring rapid and efficient boiling processes has been the focus of industry as they have the potential to improve the energy efficiency and reduce the carbon emissions of production processes. Here, we report nanoscale thin-film boiling on different heterogeneous surfaces. Through nonequilibrium molecular dynamics simulation, we captured the triple- phase interface details, visualized the bubble nucleation, and recorded the internal fluid flow and thermal characteristics. It is found that nanoscale thin-film boiling without the occurrence of bubble nucleation shows excellent heat and mass transfer performance, which differs from macroscale boiling. In general, rough structures advance the onset time of stable boiling and improve the efficiency. The heat transfer coefficient and heat flux on a rough hydrophilic surface respectively reach to 7.43 x 10(4) kW/(m(2).K) and 1.3 x 10(6) kW/m(2) at a surface temperature of 500 K, which are 100-fold higher than those of micrometer-scale thin-film boiling. However, due to the resultant vapor film trapped between the liquid and the surface, the rough hydrophobic surface leads to heat transfer deterioration instead. It is revealed that the underlying mechanism of regulatory effects resulting from surface physicochemical properties is originated from the variation of interfacial thermal resistance. It is available to reduce the overall interfacial resistance and further improve the heat and mass transfer efficiency through increasing surface roughness, enhancing surface wettability, and increasing the area proportion of the hydrophilic region. This work provides guidelines to achieve rapid and efficient thin-liquid-film boiling and serves as a reference for the optimized design of surfaces utilized for high-heat flux removal through vaporization processes.

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