Solder Joint Grain Boundary Structure and Diffusivity via Molecular Dynamics Simulations

C Basaran and MS Sellers and AJ Schultz and DA Kofke and Y Lee, 2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 514-517 (2012).

We investigate the effect of various amounts of Ag and Cu solute atoms on the self-diffusivity of Sn in the (101) symmetric tilt beta Sn grain boundary. Using molecular dynamics (MD) simulations over a temperature range of 300K to 450K, we show that both Ag and Cu decrease the grain boundary self-diffusivity of Sn, as the amount of solute in the interface increases. Additionally, the presence of Ag at the grain boundary interface causes a greater reduction in the self-diffusivity of Sn when compared to Cu. We also analyze the solute effect on the diffusive width of the interface and find that low concentrations of both Ag and Cu shrink the width relative to the pure beta Sn interface.

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