Epoxy composite with metal-level thermal conductivity achieved by synergistic effect inspired by lamian noodles

MH Li and LH Li and YP Chen and Y Qin and XZ Wei and XD Kong and ZB Zhang and SY Xiong and H Do and JC Greer and ZB Pan and XX Shui and T Cai and W Dai and K Nishimura and CT Lin and N Jiang and JH Yu, COMPOSITES SCIENCE AND TECHNOLOGY, 228, 109677 (2022).

DOI: 10.1016/j.compscitech.2022.109677

To enhance thermal dissipation from packaged electronic components, a material with high thermal conductivity and low coefficient thermal expansion is required. In this work, a strategy inspired by the processing of lamian, a type of traditional Chinese noodle, is proposed. By combining two important methods, aligning filler and bridging effect, the method can construct composites with both high thermal conductivity and coefficient thermal expansion. The epoxy composite exhibits a high thermal conductivity of 110 W m(-1) K-1 and a low coefficient of thermal expansion of 7.4 ppm K-1, which can be compared to the value for metals. On the other hand, the material's density is comparable to that of polymers and is consequently much lower than that of typical metals. Considering these advantageous properties, it is anticipated that these composites can play a leading role in the development of new, low cost packaging materials.

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