Ultratough Hydrogen-Bond-Bridged Phosphorene Films
ZF Liu and HP Wang and HQ Cao and D Xie and C Li and HJ Yang and WQ Yao and AK Cheetham, ADVANCED MATERIALS, 34, 2203332 (2022).
The rapid development of flexible electronic devices, especially based
on 2D materials, has triggered the demand for high-strength materials.
Mono- or few-layer phosphorene with excellent electronic properties has
attracted extensive attention. However, phosphorene is affected by its
low Young's modulus when applied to flexible electronic devices. Here, a
strategy via ion intercalation to significantly improve the mechanical
properties of black phosphorus to generate hydrogen-bond-bridged
phosphorene films with Young's modulus as high as 316 GPa is reported.
This value is several times larger than the theoretical values of 166
GPa in the zigzag direction, 44 GPa in the armchair direction, and the
averaged Young's modulus among all directions of 94 GPa. The impact of
intercalation on mechanical properties is also explored. Experimental
nanoindentation results obtained by atomic force microscopy indicate
that the relationship between the ratio of intercalated ions to
phosphorus atoms and the corresponding Young's modulus satisfies the
Return to Publications page