Molecular dynamics simulation of tin whisker growth in three-point bending copper-tin coating under multi-field coupling

L Zhang and DJ Xiong and LM Yin and HH Zhang, CHEMICAL PHYSICS LETTERS, 811, 140220 (2023).

DOI: 10.1016/j.cplett.2022.140220

The tin whisker growth of Sn/Cu/Sn coating and the interface stress change under three-point bending are simulated by using the modified embedded atomic potential under different temperatures and indenter veloc-ities. The interface stress in each region is generally on the rise trend during the bending process of the coating. Tin whisker growth is a dynamic process of stress accumulation and release in the coating. There is a critical indenter speed value during the period of 0.5-1 angstrom /ps, which makes the stress balance appear in the tensile area, thereby inhibiting the precipitation of tin atoms.

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