The effect of interface orientation on deformation behavior of Cu/Al multilayer during tensile process

WW Pang and K Xin and AS Liu and RB Chen and SY Yu, MATERIALS TODAY COMMUNICATIONS, 34, 105133 (2023).

DOI: 10.1016/j.mtcomm.2022.105133

The effect of interface orientations on deformation behavior of Cu/Al multilayer is investigated via molecular dynamics. It is found that the mechanical properties of Cu/Al multilayer significantly depend on interface ori-entations. The plastic deformation is triggered by nucleating of new lattice dislocation for two models with (111) and (001) interface orientations, and plastic deformation is triggered by slipping of original misfit dislocation on the interface for the other two models with (110) and (112) interface orientations. In addition, the models with (111), (001) and (112) interface orientations have stronger barriers for dislocation crossing the interface, and almost no plastic deformation occurs in Cu layer. The theoretical calculations show that the preferentially activated slip systems are determined not only by stress component but also by original misfit dislocation. The calculated dislocation density curves indicate that both the increase rates and duration times of Shockley partial dislocations for all models are different. Besides, at the late stage of plastic deformation, Sphere- like and disc-like voids form near the interface for the first two models, respectively, and strip-like voids form on the misfit dislocation lines for the last two models.

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