Quantitative analysis of grinding performance of cubic silicon carbide surface texture lubricated with water film

ZZ Ou and WL Wu and HF Dai, TRIBOLOGY INTERNATIONAL, 180, 108267 (2023).

DOI: 10.1016/j.triboint.2023.108267

Molecular dynamics (MD) simulation was applied to construct the conventional surface, micro textured surface and water lubricated textured surface of cubic silicon carbide (3 C-SiC) workpiece, which were then subjected to grinding by diamond abrasive particles. The results indicated that the textured surface can significantly improve the surface quality and reduce the grinding force, stress, grinding temperature and subsurface structure damage. Moreover, water lubricated textured surface can further reduce grinding temperature and subsurface damage depth, but it increases grinding force and stress. Finally, the increase in grinding depth increases the removal rate of silicon carbide, but the stress, grinding force, grinding temperature, potential energy and subsurface structure damage increase accordingly. The water lubricated textured surface has innovative significance in processing 3 C-SiC.

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