A thermal management strategy for electronic devices based on copper double skin inspired hydrogel

LS Sheng and Y Wang and X Wang and CL Han and ZQ Chen, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 206, 123946 (2023).

DOI: 10.1016/j.ijheatmasstransfer.2023.123946

A passive cooling material was proposed by combining the advantages of an interpenetrating polymer network and copper powder. The experimental thermal conductivity of copper based composite hydro-gel was enhanced to 0.71 W/(m center dot K). At the same time, MD simulations showed a thermal conductivity of approximately 0.84 W/(m center dot K), which primarily caused by the increased overlap between hydrogel com-ponents. Due to the improvement of the thermal conductivity, the heat flux of copper based composite hydrogel increased to 977 W/m2 at a constant heat source temperature of 65 degrees C and the total heat dis-sipation increased by 104.4%. The thermal management tests showed copper based composite hydrogel could reach 35 degrees C, while the copper based composite hydrogel could reach 50 degrees C. The obtained copper based PNIPAM/Alginate-Ca2 + hydrogel exhibited a synergistic property enhancement of high thermal con-ductivity, stability in shape and decreased aggregation of the copper nanoparticles, which should provide a new strategy for thermal management.(c) 2023 Elsevier Ltd. All rights reserved.

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