Thermal cloaking phenomenon in the convex structure silicon film

J Zhang and HC Zhang and Q Wang and WB Sun, SOLID STATE COMMUNICATIONS, 364, 115131 (2023).

DOI: 10.1016/j.ssc.2023.115131

Silicon thin films have important applications in the electronics and nanotechnology industries, and with the miniaturization of electronic devices, the importance of thermal protection for electronic devices is increasing. The researchers have successfully constructed thermal cloaks based on silicon films through amorphization, perforation, and concave to achieve heat flux regulation. The key to designing a thermal cloak is to use appropriate means to construct a functional region with low thermal conductivity. Our recent research has found that the thermal conductivity of periodically convex silicon films is lower than that of perfect silicon films, and no thermal cloaks have been constructed using this method. Therefore, in this paper, a thermal cloak is constructed using a periodically convex structure and compared with a thermal cloak of the same concave depth. By calculating the ratio of thermal cloaking (RTC), we find that cloaking can be produced using the convex structure, but is less effective compared to the concave structure, mainly because the base film is a perfect silicon film, which does not affect the heat flux transmission. Finally, we use phonon localization theory to explore the underlying mechanism. By calculating the mode participation rate (MPR), we find that phonon localization in the functional region is the main reason for cloaking, and the low-frequency phonon modes contribute more to the cloaking efficiency. Our study can provide experience for the design of nanoscale thermal cloaks.

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