Grain size responsive uniaxial tensile behavior of polycrystalline nanocopper under different temperatures and strain rates

R Kumar and MK Gupta and SK Rai and V Panwar, MULTIDISCIPLINE MODELING IN MATERIALS AND STRUCTURES, 19, 507-521 (2023).

DOI: 10.1108/MMMS-09-2022-0187

PurposeThe changes in tensile behavior of polycrystalline nanocopper lattice with changes in temperature, average grain size (AGS) and strain rate, have been explored. The existence of a critical AGS has also been observed which shows that the Hall-Petch relationship behaves inversely.Design/methodology/approachNanoscale deformation of polycrystalline nanocopper has been done in this study with the help of an embedded atom method (EAM) potential. Voronoi construction method has been employed for creating four polycrystals of nanocopper with different sizes. Statistical analysis has been used to examine the observations with emphasis on the polycrystal size effect on melting point temperature.FindingsThe study has found that the key stress values (i.e. elastic modulus, yield stress and ultimate tensile stress) are significantly influenced by the considered parameters. The increase in strain rate is observed to have an increasing impact on mechanical properties, whereas the increase in temperature degrades the mechanical properties. In-depth analysis of the deformation mechanism has been studied to deliver real-time visualization of grain boundary motion.Originality/valueThis study provides the relationship between required grain size variations for consecutive possible variations in mechanical properties and may help to reduce the trial processes in the synthesis of polycrystalline copper based on different temperatures and strain rates.

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