Thermal effects on removal mechanism of monocrystal SiC during micro- laser assisted nanogrinding process

BB Meng and C Li, CERAMICS INTERNATIONAL, 49, 15349-15356 (2023).

DOI: 10.1016/j.ceramint.2023.01.119

As a hard-brittle material, research into efficient processing methods of monocrystalline SiC with low damage has attracted a lot of attention. In this paper, removal behavior of monocrystalline SiC using micro-laser assisted method is analyzed using molecular dynamics method. This enables an in-depth theoretical analysis of thermal effects on material removal mechanism for 3C-SiC during nanogrinding process. Taking average laser pulse intensity as a variable, the micro deformation mechanism and machinability under the micro-laser assisted method are analyzed in detail. The results show that laser irradiation can directly affect material removal rate and subsurface damage depth of 3C-SiC. The results of this work significantly improve the understanding of the feasibility of micro-laser assisted method and its optimization for 3C-SiC.

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