Effect of interface structure and layer thickness on the mechanical properties and deformation behavior of Cu/Ag nanolaminates

YX Liang and AB Luo and LW Yang and JF Zhao and LB Wang and Q Wan, PHYSICA B-CONDENSED MATTER, 661, 414933 (2023).

DOI: 10.1016/j.physb.2023.414933

We performed molecular dynamics (MD) simulations to study the effect of interface structure and layer thickness on the mechanical properties of multilayered Cu/Ag composite with Cu111//111Ag and Cu100//100Ag interfaces. The results indicate that deformation twinning is the dominant plastic deformation mode in the multilayer with Cu100//100Ag interfaces and differs from the dislocation slip in the models containing Cu 111//111Ag interfaces. The interfaces in the Cu111//111Ag multilayer are significantly roughened by dislocation transmission across interfaces. The Shockley partial dislocations are difficult to cross Cu100// 100Ag interface until the interface is twisted by deformation twinning. The deformation twinning in the Ag channel induces twists of Cu100//100Ag interface, facilitating twinning in Cu channels and dislocation transmitting across the Cu/Ag interface within twin bands. The mechanism results in strong interface roughening. The Cu110//110Ag interface is formed after the deformation twinning in models containing Cu 100//100Ag interfaces, which exhibits extremely high shear strength than the Cu100//100Ag interface and produces a weak blocking effect on gliding dislocations.

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