Study of wetting promotion mechanism of Sn/Cu interface assisted by ultrasonic vibration from molecular dynamics simulation and experiments

WS Bian and XG Chen and WB Guo and HT Xue and CX Chen and C Fan and AH Li and YR Hu, MATERIALS TODAY COMMUNICATIONS, 35, 106285 (2023).

DOI: 10.1016/j.mtcomm.2023.106285

In this study, molecular dynamics method was used to simulate ultrasonic vibration by applying periodic displacement to the fixed substrate, and the wetting promotion mechanism of liquid Sn/solid Cu system under ultrasonic vibration was studied. The results indicated that whether wetting with or without ultrasonic vibration, the contact angle decreased and interfacial reaction intensified with the increase of temperature. The contact angle with ultrasonic vibration was smaller than that without ultrasonic vibration, and the difference between contact angles decreased with the increase of temperature. In addition, the frequency of ultrasonic vibration had a significant effect on the wettability. The intermetallic compound (IMC) layer was broken by 250 GHz ultrasonic vibration. However, low-frequency ultrasonic vibration was not enough to break the IMC layer, and the influence on interface was mainly reflected in promoting the spreading of precursor film and the interface reaction. In addition, the experimental results at different temperatures showed that ultrasonic vibration improved the wettability. The wetting promotion mechanism: ultrasonic vibration introduced alternating pressure and tension, which accelerated the diffusion of atoms, promoted the interface reaction. And ultrasonic vibration broke the reaction layer and promoted the dissolution and diffusion between solid-liquid atoms, the wettability of Sn /Cu system was improved.

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