Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

QH Fang and Q Wang and J Li and X Zeng and YW Liu, RSC ADVANCES, 7, 42047-42055 (2017).

DOI: 10.1039/C7RA06975H

The molecular dynamics (MD) simulation of Ni/Cu multilayers under a high speed grinding process with a diamond tip is performed, with the aim of investigating the effects of varying machining parameters on subsurface damage and material removal in the Ni/Cu multilayers. A series of key factors, consisting of grinding speed, tool radius and depth of cut, that influence the deformation of the workpiece are systemically studied in terms of surface morphology, dislocation movement, grinding temperature and average grinding force. Both the grinding temperature and force increase with increasing grinding speed, tool radius and depth of cut. In addition, a relatively small grinding velocity results in more stacking faults (SF) and a greater volume of material pileups on the sides of the groove. A good surface integrity of the Ni/Cu multilayers, with relatively fewer lattice defects, is more easily obtained by a machining process with a smaller tool radius or cutting depth. The results also show that the grinding temperature of Ni/Cu multilayers with varying grinding speeds, tool radii and cutting depths is higher than that of pure Ni thin film.

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